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Smartphones: TDK et Qualcomm form $3bn joint-venture

Karl Hepp de Sevelinges

Paris, January 20, 2016

Japan’s components manufacturer TDK Corp. and American chipmaker Qualcomm Inc. announced an agreement to form a joint-venture to provide industry-leading RF front-end-solutions for mobile devices.

Jeantet assisted TDK together with Morrison Foerster on the French aspects of the transaction with Karl Hepp de Sevelinges, partner, and Ingrid Fauvelière, counsel (M&A).

Qualcomm was advised by DLA Piper.